Ultrasonic cleaning of power circuit boards, as an efficient and precise cleaning method, has been widely used in fields such as electronic manufacturing, maintenance, and scientific research. Its working principle is to use the small bubbles generated by ultrasound in the liquid, and through the rapid generation and rupture of the bubbles, strong impact and shear forces are formed, effectively removing dirt, grease, and other attachments on the circuit board.

During ultrasonic cleaning, the power circuit board is placed in the cleaning solution. The high-frequency vibration generated by the ultrasonic generator continuously generates and explodes tiny bubbles in the cleaning solution. The explosive force of these bubbles can penetrate into the tiny gaps of the circuit board, stripping away impurities such as dust and oxides hidden inside one by one. At the same time, the vibration of ultrasound can also make the chemical components in the cleaning solution more evenly distributed on the surface of the circuit board, enhancing the cleaning effect.

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